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PROJECT EXAMPLE 1
A manufacturer of turbine engines was experiencing problems with one line of turbines. Something was causing the blades to brake loose causing catastrophic failure. The investigation centered on a new brand of bearings that were being used. The manufacturer of the bearings claimed that they were high-grade stainless steel, however, analysis by Scanning Electron Microscopy (SEM) proved otherwise.
A cross-section of the bearing was analyzed so that the O-ring and the metal would be visible. In the photograph above can be seen dark spots throughout the metal. These are places of high carbon content. Stainless steel does not contain these abnormalities. Furthermore, the circled area is rust pitted metal.
The cause of the failure in the engines was insufficiently manufactured bearings. These bearings are water-cooled and had a tendency to rust. The pitting allowed the cooling water to penetrate the turbine chamber. It only takes a few drops of water to break turbine fins that are traveling over 10,000 revolutions per minute and cause the catastrophic failures.
PROJECT EXAMPLE 2
A motorcycle was involved in an automobile accident that occurred after dark. EMSL was asked to determine if the headlight of the motorcycle was on or off at the time of the accident. EMSL examined the filament of the smashed headlight and found, with Scanning Electron Microscopy (SEM) and X-Ray Microanalysis (EDX), the presence of microscopic glass fragments bound to the filament, thus proving that the filament was hot at the time of the accident.
PROJECT EXAMPLE 3
An automobile was involved in an accident and the driver claimed that he could not stop. Upon inspection by a mechanic it was determined that the brake shoes may have been faulty. EMSL was asked to analyze the brakes. Extensive testing with Scanning Electron Microscopy revealed cracks and pores within the pads that were not within the tolerance limits for brake shoes. These defects caused the collapse of the brakes.
PROJECT EXAMPLE 4
A comupter corporation was having problems with computer failures. After careful analysis by Scanning Electron Microscopy, we were able to determine the failure on the semiconductor due to manufacturing problems.
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